Fusion Thermal Putty

Fusion Thermal Putty delivers high-performance thermal management with 8.0 W/mK conductivity. Its unique moldable consistency makes it perfect for irregular surfaces and gap-filling applications in CPUs, GPUs, gaming consoles, and server environments.

• Thermal conductivity: 8.0 W/mK
• Non-electrically conductive
• Moldable — adapts to any surface shape
• Long-term stability
• Safe & non-toxic

Engineered with German precision.